Application of Viscoplastic-Creep Separate Constitutive Model to Lead-Free Solder Alloy
نویسندگان
چکیده
منابع مشابه
A New Creep Constitutive Model for Eutectic Solder Alloy
In this study, a large number of creep tests were carried out to study the effect of stress level and testing temperature on the creep behavior of 63 Sn/37Pb solder in a systematic manner. Based on the dislocation controlled creep mechanism and Gibbs’ free-energy theory, a new creep constitutive model was proposed. The model was found to describe accurately the creep flow of the solder and to b...
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For many of the Pb-free solders required under the European RoHS directive, there is now sufficient information, primarily in the form of the results of accelerated thermal cycling of various levels of severity, to develop acceleration models for the creep-fatigue of these solders. In this paper the parameters for the SAC405/305, SAC205, SAC105 and SnAg to replace the parameters for eutectic Sn...
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When electric current flows in a solder bump, electromigration generates stress, but creep relaxes it. After some time, the bump develops a steady-state stress field. We present a theory to show that the two processes — electromigration and creep — set an intrinsic length. When the intrinsic length is large compared to the height of the bump, electromigration is fast relative to creep and the s...
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The creep phenomenon is considered as one of the most important deformation mechanisms under working conditions. The present study has examined the microstructure and creep properties of Sn-9.0Zn-0.5Al solder alloy after adding a small amount of Antimony (Sb). Nominal compositions of Sb additions were chosen to be 0, 0.5, 1.0, and 1.5 wt.%. The minimum strain rate was reduced for the Sb contain...
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Purpose – The aim of this work is the use of specially designed, authoring device to evaluate the strength of solder alloys commonly used in all kinds of electronic and electrical devices that are used in various fields of economic and industrial development to shorten the testing period. By obtaining answers to pervade science questions on how to properly investigate the reliability of solder ...
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ژورنال
عنوان ژورنال: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
سال: 2011
ISSN: 0387-5008,1884-8338
DOI: 10.1299/kikaia.77.1169